Home / Products / Integrated Circuits (ICs) / Memory / TC58BYG0S3HBAI4
Manufacturer Part Number | TC58BYG0S3HBAI4 |
---|---|
Future Part Number | FT-TC58BYG0S3HBAI4 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Benand™ |
TC58BYG0S3HBAI4 Status (Lifecycle) | In Stock |
Part Status | Active |
Memory Type | Non-Volatile |
Memory Format | FLASH |
Technology | FLASH - NAND (SLC) |
Memory Size | 1Gb (128M x 8) |
Clock Frequency | - |
Write Cycle Time - Word, Page | 25ns |
Access Time | - |
Memory Interface | - |
Voltage - Supply | 1.7V ~ 1.95V |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 63-VFBGA |
Supplier Device Package | 63-TFBGA (9x11) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TC58BYG0S3HBAI4 Weight | Contact Us |
Replacement Part Number | TC58BYG0S3HBAI4-FT |
W25Q128FVCIF
Winbond Electronics
W25Q128FVCIG
Winbond Electronics
W25Q128FVCIG TR
Winbond Electronics
W25Q128FVCIP
Winbond Electronics
W25Q128FVCJF
Winbond Electronics
W25Q128FVCJF TR
Winbond Electronics
W25Q128FVCJQ
Winbond Electronics
W25Q128FVCJQ TR
Winbond Electronics
W25Q16DVTCIG
Winbond Electronics
W25Q256FVCIF
Winbond Electronics
XC2V3000-5FGG676I
Xilinx Inc.
M2GL025TS-1FCSG325I
Microsemi Corporation
AX125-1FG256I
Microsemi Corporation
EP4CGX50DF27C7
Intel
EP3SL70F484I3N
Intel
EP2AGX45DF25C6
Intel
5SGXMB9R3H43C3N
Intel
XC5VSX240T-2FF1738CES
Xilinx Inc.
XC2VP4-5FF672C
Xilinx Inc.
LFE3-95EA-7LFN1156C
Lattice Semiconductor Corporation